Sn99.5Cu0.5 lead free solder wire
Junping Shao
Contact person
Basic Information
ItemSpecificationsFlux content(%)2.0±0.2Specific gravity7.3Liquidus temperature227Solidus temperature227Package weightDiameter<0.8mm,0.5kg ; Diameter>0.8mm,1.0kg Package unit 10 spools/boxUsageSuitable for use with standard wave soldering/solder postsRegulation201BStorage information and warrantee periodStore in a cool, dry, non-corrosive environment. Product warrantee period of 3 yearsChemical composition of solder alloyMetal elementSnCuComposition(%)Blance0.5Maximum threshold of impurities in solder alloyMetal elementBiZnFeAlAsAgCdPbSbComposition(%)0.10.0020.020.0020.03----0.0020.10.12Notes: This product and all components are compliant with RoHs and GB/T 20422-2006Product Specifications:Flux NameRMARAChl or inity<0.10.1 0.5Copper Plate Corrosionno corrosion occurredno corrosion occurredInsulating Resistivitymore than 1x1011Ωmore than 1x1010ΩExpansionmore than 80%more than 80%Sn99.5Cu0.5 lead free solder wire
Delivery terms and packaging
Packaging Detail: Sn99.5Cu0.5 lead free solder wirea) Wire dimensions: Diameters from 0.5 mm to 5 mmb) Supplied on spools: 250g, 500g, and 1kgc) Packed in cartons of 60 x 250 g, 40 x 500g, 20 x 1kgd) Boxes and spools carry product information labelse) Quality assurance: Certificates of Conformity can be issued for each shipment batch if requested at the time of ordering Delivery Detail: with 10 days after receiving the deposit
Port: Shanghai or Ningbo
Payment term
Letter of credit
Telegraphic transfer
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